Upcoming Event: Waste Reduction Panel Discussion at PACK EXPO

Posted by Admin on Mar 22, 2016 2:19:23 AM

Upcoming Event: Waste Reduction Panel Discussion at PACK EXPO

 

During PACK EXPO 2014, Food Engineering Magazine and Haskell will host, PackAGE, an expert panel discussion concerning packaging's future and role in waste reduction. Attendees will hear from notable authorities within all facets of the food and beverage industry and have a chance to formulate solutions to issues facing manufacturers today. 

 

We would love for you to participate by attending this thought-provoking event! With only 100 seats available, we want to be sure you don’t miss out. Did we mention that lunch is provided? Reserve your seat today!
 


Learn more about the panel discussion by viewing the SlideShare above.

Meet the Panel

 

Dennis Heldman Ph D

Dennis Heldman, Ph.D.

Dennis R. Heldman Ph.D.
Professor of Food Engineering, The Ohio State University Panelist Dennis R. Heldman was awarded B.S. (1960) and M.S. (1962) degrees from The Ohio State University, and a PhD (1965) from Michigan State University. His educational background emphasized the application of engineering principles and concepts to the processing of foods. 
In 1966, Heldman joined the faculty at Michigan State University, and began teaching and research in the area of food process engineering. In 1975, the first edition of Food Process Engineering (by Heldman), a textbook for undergraduate engineering students, was published. He served as Chair of the Agricultural Engineering Department at Michigan State University from 1975 to 1979. In 1981, the second edition of Food Process Engineering (with R. Paul Singh) was published, and in the 1984, the first edition of Introduction to Food Engineering (with R. Paul Singh) was published. 

 

Heldman joined the Campbell Soup Company in 1984, as the Vice President of Process Research and Development. In 1986, he moved to the National Food Processors Association, as Executive Vice President of Scientific Affairs, CEO for The National Food Laboratory, and President of The Food Processors Institute. In 1991, Dr. Heldman joined the Weinberg Consulting Group Inc, and was involved in consulting on food regulatory issues. In 1992, the first edition of the Handbook of Food Engineering (Heldman and Daryl B. Lund as Co-Editors) was published.

 

From 1992 to 2004, Heldman was Professor of Food Process Engineering at the University of Missouri (MU) and at Rutgers, The State University of New Jersey. From 2004 to 2012, Heldman was a consultant involved in applications of engineering concepts to food processing for educational institutions, industry and government.

In August, 2012, Heldman joined the faculty at The Ohio State University as Dale A. Seiberling Endowed Professor of Food Engineering. He is involved in teaching and research in the area of food engineering, with a focus on sustainability of the food system, and specifically on improvement in process efficiencies while enhancing product quality.   


 

Michael Ballard

Michael Ballard
 

Michael Ballard
Director of Packaging Engineering, General Mills Panelist
 

Michael Ballard is currently the Director of Packaging Engineering at General Mills, a role he has had since April 2007. Michael has been with General Mills since October 1989 in a variety of roles of increasing responsibility in the Engineering function. Prior to joining General Mills, Michael worked as a Lead Systems Application Engineer with Kellogg’s in several locations, and as a Project Engineer / Controls Engineer at Mead Johnson Nutritionals. He interned as a Patent Examiner in Training at the U.S. Patent & Trademark Office, Washington, DC.

 

Michael received his BS in Electrical Engineering from The University of Evansville in 1982, and completed his Executive MBA at the University of Minnesota in 2001. Michael is currently co-leader of the Manufacturing and Engineering Associate (MEA) program, and was formerly the Engineering Development Program lead advisor. He is an active participant in the Partners for Food Solutions program, and lifetime mentor in the various GMI mentoring programs. Michael currently is one of the System Engineering steering team members, as well as a member of the engineering function’s Technical Mastery steering team. In the past, he chaired the General Mills Technical Conference and has served on the Bell Achievement Awards selection committee, and is active with several internal General Mills organizations including the Black Champions Network, ITQ-T2 council, Supply Chain BLC, and the MLK breakfast program committee.  

 

Joyce Fassl

Joyce Fassl

Joyce Fassl

Editor in Chief, Food Engineering Magazine | Moderator
 

Joyce Fassl has spent most of her career in magazine management. As editor in chief of Food Engineering, Fassl has directed the magazine’s editorial staff since 1986, except for a two-year stretch where she oversaw content direction for the debut of Packexpo.com. Her expertise is creating dynamic print and online content, building top-notch editorial teams and managing innovative custom publishing projects and live events. She holds a bachelor’s degree in journalism from Penn State University. In addition to supervising all Food Engineering content, Joyce is Program Director for the Food Automation & Manufacturing Conference.

 

Keith Perkey

Keith Perkey

Keith Perkey

Vice President of Packaging, Haskell Panelist
 

Keith is a Regional Vice President in charge of Haskell’s Packaging Center of Excellence, in Atlanta, Georgia. Haskell’s Packaging Center of Excellence is a packaging systems integration and consulting center that has been implementing packaging projects since its inception in 1985. Keith has 20+ years of experience in food, beverage, consumer, and pharmaceutical products packaging. Keith has been involved with all phases of completing a capital project from concept to post start-up optimization. He has significant experience with snack foods, distilled spirits, beer, juice, frozen/refrigerated dough, bars, cereal, pharmaceutical and consumer products packaging.

 

Keith has a Bachelor of Science in Mechanical Engineering from the University of Florida in Gainesville, FL and an MBA from Georgia State University in Atlanta, GA and has his Project Management Professional certification from the Project Management Institute.  


Are you attending PACK EXPO 2014? If so, join us for PackAGE: Packaging's Future and Role in Waste Reduction on November 4, 2014 from 11:30 am to 1:00 pm in the South Hall of McCormick Place. Remember, there are only 100 seats available, so be sure to reserve your seat today!

 

Topics: Processing and Packaging, Innovation